APLF and ACLE launch their version of hybrid fairs with a new platforms

24 May 2021


The APLF, the great meeting point of the leather industry and its manufactures, issued a statement in which it informs that to face the effects of the prolonged global pandemic it has generated "a digital platform of excellence to allow the holding of hybrid fairs" . In this way it seeks to "collaborate to maintain the level of its business contacts as much as possible, especially those professionals who cannot or do not wish to travel to Hong Kong or Shanghai."

The systems department of the controlling company of APLF, Informa Markets has developed a virtual platform "as dynamic and efficient as it is simple to use -they explain-, which will work simultaneously with the face-to-face performance of the fairs."

The organizers emphasize that through this virtual platform, companies will be able to participate remotely in APLF's hybrid fairs and take full advantage of the business opportunities offered from their headquarters in Hong Kong or ACLE from their place in Shanghai.

The proposal offers a hybrid package so that exhibitors who cannot or do not want to travel in 2021 take advantage of business opportunities with their current clients or to make new contacts "

The participation package includes a small stand at the fair, physically attended by English-speaking personnel, with whom the company will be in permanent communication. The offer contains a computer with which to hold videoconference meetings with buyers present at the fair or also participating virtually. The proposal also includes online promotion before, during and after the fair.

According to the information presented, the cost of the participation package is per fair and applies to APLF Leather, Materials +, Fashion Access in Hong Kong and ACLE in Shanghai. It also includes participation in the B2B Sampleroom platform. On the other hand, the exhibitors who will participate in the fair in March 2022, can also participate in the fair in November 2021 through the hybrid module.



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